New Broadcom ethernet solution is first to pack 100 switches on a chip

29th August 2012
New Broadcom ethernet solution  is first to pack 100 switches on a chip

Bangalore, August 29, 2012: Global semiconductor solutions leader Broadcom has brought to India, the world’s first solution that delivers over a hundred 10 Gigabit Ethernet ports on a single slab of silicon. The StrataXGS Trident II Series which also features the highest density packaging of a 10/40 Gigabit Ethernet switch, is aimed at cloud networking environments and mega data centres. It promises a 4-fold increase in network virtualization scale and a 2X increase in forwarding and classification.

Says Ram Velaga, Vice President & General Manager, Core Switch, Broadcom “Our latest StrataXGS Trident II Series – a follow-on to the highly successful Trident series of single chip switch solutions – delivers unprecedented innovation with new features optimized to meet the performance, scalability and efficiency demands of both the traditional enterprise and emerging mega data centers, enabling a new era in cloud-scale and software defined networking.”
Arpit Joshipura, Vice President, Dell says:“Dell plans to be one of the first to offer customers the StrataXGS Trident II series that will enable next-generation Dell networking products designed for large-scale cloud and enterprise data centers.” Product details: