IIT Madras signs multiple MOUs for its chip designs

01st May 2022
IIT Madras signs multiple MOUs for its chip designs
Prof Kamakoti of IIT Madras formalising an MOU at Semicon India 2022

Bangalore, May 1 2022: Multiple Memorandum of Understanding (MoUs) were  signed between the Government, leading semiconductor industry players and industry associations on the sidelines of the Semicon India expo ongoing here
 Recently India has announced the DIR-V Programme to develop “siliconize” and create design wins for future around  the msde-in-India SHAKTI and VEGA RISC-V Processors.
The DIR-V Programme with Prof. Kamakoti, Director, IIT Madras as Chief Architect and Krishna Kumar Rao as Program Manager has been initiated with a vision to make India not only a RISC-V Talent Hub for the World but also supplier of DIR-V solutions for Servers, Mobile devices, Automotive, IoT & Microcontrollers across the globe.
DIR-V has announced Five MoUs for the use of indigenously developed RISC-V Processors -SHAKTI and VEGA.
-MoU between SONY India and DIR-V SHAKTI Processor (IIT Madras) for the Systems/Products developed by SONY.
-Between ISRO Inertial Systems Unit (IISU), Thiruvananthapuram and DIR-V SHAKTI Processor (IIT Madras) for development of high performance SoCs (System on Chip) and for Fault Tolerant Computer Systems.
-Between Indira Gandhi Centre for Atomic Research (IGCAR), Department of Atomic Energy and DIR-V SHAKTI Processor (IIT Madras) for the Systems/Products developed by IGCAR.
-Between Bharat Electronics Limited (BEL) and DIR-V VEGA Processor (C-DAC) for Rudra Server board, Cyber security, and Language Solutions.
B-etween Centre for Development of Telematics (C-DOT) and DIR-V VEGA Processor (C-DAC) for the 4G/5G, Broadband, IOT/ M2M solutions
Additionally, an intent of MoU was announced between IISc Bangalore and SEMI, USA for building core competence of quantum technologies - multi-qubit superconducting quantum processors, photonic processors, diamond-based magnetometers, lab-level quantum-secured communication network etc.