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Synopsys IP for USB 3.0 chips are a big success

Bangalore, August 24, 2014:   Global leader in chip software and IP, Synopsys,  reports  significant success with its  DesignWare IP for USB3.0  system on a chip:  over 100 million  have been shipped.

These are used in mobile computing, digital home and cloud computing applications such as smartphones, tablets, set-top boxes, digital TVs, gaming systems and servers.More than sixty companies have successfully integrated silicon-proven DesignWare USB 3.0 IP into their products’SoCs, including SoCs in the MicrosoftXBOX One.

“Based on a long history of close collaboration with Synopsys, we have shipped hundreds of millions of products that incorporate Synopsys’ DesignWare USB 2.0 and 3.0 IP. In the last year alone, tens of millions of units were shipped globally,” said Sanghyun Lee, vice president of digital IP development team, System LSI Business at Samsung Electronics. “By using Synopsys’ DesignWare USB 3.0 IP, Samsung can deliver leading SoC products to  customers.

Synopsys’ complete USB 3.0 IP solution,including controllers, PHYs, verification IP, IP Prototyping Kits and IP Virtual Development Kits,reduces design risk andacceleratesIP prototyping, software development and integration. 





    


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